Abstract
The electronic parts and devices are improved in their performance year by year, because the miniaturization of the electronic equipment is strongly demanded. For example, stacked CSPs (chip size packages) for memory module come to be popular in mobile phones, digital cameras etc. recently. Many kinds of soft-materials are used in electronic materials such as laminates, die-bonding materials, epoxy molding compounds, etc., which are very important in stacked CSPs. In this paper, the features of the electronic materials based on soft-materials and manufacturing processes of stacked CSPs are described.
