A Fully-Integrated MMIC Technology Employing a Novel Chip-Size Package

Abstract

In this work, we used a novel CSP to develop a broadband amplifier MMIC for quasi millimeter-wave band applications, including all the matching and biasing components. By utilizing an ACF for the CSP, the fabrication process for the packaged amplifier MMIC could be simplified and made cost effective. A STO (SrTiO₃) capacitor was employed to integrate the DC biasing components of the MMIC. Pre-matching circuits were used for the gate input and drain output of the FETs in the design of the broadband amplifier MMIC. The packaged amplifier MMIC exhibited good RF performance and stability over a wide frequency range.