Thermal Stress Evaluation of Printed Circuit Board Due to Heat of Mounted Parts by Using Holography Technique

Abstract

In this study, the temperature and displacement of printed circuit board (PCB) due to heat of mounted parts were measured by using a thermographic video system and a holographic interferometry measuring system. The relationship between temperature and displacement was studied from the experimental results.
As the results, the temperature and displacement on the PCB surface have been influenced with heat of mounted components due to current flow. The distribution of temperature showed some different relationships with the characteristics of the deformation. Therefore, the holographic pattern testing method may be useful in analysis of the detailed thermal stress evaluation of PCB surface and mounted parts.