Abstract
Accompanying the miniaturization and lightening of electric products, high density mounting of printed circuit boards is accelerating. Positioning by image processing has become indispensable for mounters such as chip shooters to improve mounting accuracy. Mounting speed is a large factor in determining a chip shooter's performance. Recently, the ratio that IC parts hold and the number of IC pins are increasing, and even faster processing is being demanded by users. Positioning which utilizes template matching by means of a normalized correlation algorithm has advantages of high accuracy and resistance to the effects of lighting changes; how to reduce processing time for the expanding operation amount is the problem.
We are presenting one technique for measuring parts that has the same level of accuracy as the normalized correlation algorithm, as well as being able to conduct, high speed processing. This paper focuses on measuring the position of IC parts.
