Development of the LIGA Process using a Superconducting Compact Synchrotron Light Source

Abstract

This paper is devoted to the description of the LIGA process using a 600MeV superconducting compact synchrotron light source. The realization of deep-etch x-ray lithography is based on a new resist and mask. The resist is made of a copolymer of methyl methacrylate (MMA) and methacryl acid (MAA). The main benefit is its high sensitivity, which is one order of magnitude greater than that of polymethyl methacrylate (PMMA) used in the LIGA process. The mask is composed of a 2μm -thick silicon nitride membrane with high transparency supporting tungsten absorber which is a 5μm-thick. Experimental results about deep-etch x-ray lithography, electroforming and molding techniques are presented. Micro-ultrasonic transmitter obtained with these techniques is also shown. The purpose of this study is the realization of low cost micro-components for a variety of industrial applications.