Abstract
The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.
