Proceedings of the International Symposium on Flexible Automation
Online ISSN : 2434-446X
2022 International Symposium on Flexible Automation
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CHIP LOADING CAUSED ON ELECTROPLATED DIAMOND WHEELS IN GRINDING PROCESS FOR CFRPS
Tochi NaganoKenta KuboKeiji YamadaRyutaro TanakaKatsuhiko Sekiya
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Pages 13-14

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Abstract

In this paper, changes on electroplated diamond wheel were investigated during the trimming process of CFRP. The influences of the wheel speed to the wheel surface are examined. Fine ground surfaces and small dimensional errors proved the high machinability of the electroplated wheels. But the experimental results also showed that low speed of wheel causes excessive chip loading for very short process time and increases the grinding forces rapidly.

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© 2022 The Institute of Systems, Control and Information Engineers
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