The Effect of Substrate Dissolution in Brazing CP-Ti and Ti-15-3 Using Clad Ti–15Cu–15Ni Filler

Abstract

The effect of substrate dissolution in brazing CP-Ti and Ti-15-3 using Ti–15Cu–15Ni filler metal has been performed in the experiment. Microstructures of infrared brazed joints are strongly related to dissolution of substrate during brazing. For the 1800 s brazed CP-Ti specimen, the depletion of Cu and Ni from the braze alloy into substrate cause eutectoid transformation of β-Ti into lamellar Ti₂Cu and α-Ti. In contrast, dissolution of Ti-15-3 substrate into the molten braze during infrared brazing results in the 1800 s brazed zone alloyed with V, stabilizing the β-Ti to room temperature.