Joining of Silicon Nitride Using Glass Solders

Abstract

It is well known that segregation of Ti and formation of TiN occurs when active brazing alloys such as Ag-Cu-Ti were used for Si₃N₄ joining. Si₃N₄-Si₃N₄ joining was carried out using several glass solders containing oxides of active metal, 1A group elements and 2A group elements without applying pressure. Si₃N₄-glass reaction and bonding behavior of these elements in Si₃N₄-Si₃N₄ joint were studied. The bonding strength obtained from Silicon nitride joints using glass solder in the system SiO₂-Al₂O₃-Li₂O was strong enough for practical application.