Multi-Chip Direct Contact-Type Image Sensor using Bipolar IC

Abstract

Two flip-chip semiconductor bonding methods and two types of optical plates have been developed. In addition, two types of multi-chip direct contact-type bipolar IC image sensors have been developed for graphic image scanners used in office equipment such as facsimiles, intelligent photo copy equipment and computers. This is the first time that the above bonding methods and optical plates have been used in this kind of application. These image sensors achieve compact size, light weight and high reading performance (MTF-value 65%, Focus-depth 0.3 mm).