Proceedings of Symposium on Ultrasonic Electronics
Online ISSN : 2433-1414
12
Session ID : PB3
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PB3 Detection and Imaging of Subsurface Cracks of 30nm Width in Silicon Wafer Using Photoacoustic Microscope
Toshihiko Nakata, Yukio Kembo, Takehiko Kitamori, Tsuguo Sawada
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© 1991 Institute for Ultrasonic Elecronics
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