NCTAM papers, National Congress of Theoretical and Applied Mechanics, Japan
NCTAM papers, National Congress of Theoretical and Applied Mechanics, Japan
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OS18-2
Prediction of Warping in Silicon Wafer Slicing with Wire-Saw Machine
Takeshi IchikawaMoritaka FukunagaKunio MakinoAtsushi YokoyamaToshiro Yamada
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 265

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[in Japanese]
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© 2001 Committee for Mechanics and Structure,Science Council
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