Record of 2019 Joint Conference of Electrical, Electronics and Information Engineers in Kyushu
Session ID : 08-2P-10
Conference information
Host: Committee of Joint Conference of Electrical, Electronics and Information Engineers in Kyushu
Name : [in Japanese]
Number : 72
Location : [in Japanese]
Date : September 27, 2019 - September 28, 2019
Si(100)-GaN/Si(111) low temperature wafer bonding process for 3D power supply on chip
Details
