Journal of the Ceramic Society of Japan
Online ISSN : 1882-1022
Print ISSN : 0914-5400
ISSN-L : 0914-5400
Technical reports
Fabrication of Thick Silicon Nitride by Reaction Bonding and Post-Sintering
Naoki KONDOHideki HYUGAHideki KITATakahiro KABA
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2007 Volume 115 Issue 1340 Pages 285-289

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Abstract
Reaction-bonded silicon nitride has a potential to lower in cost, since it can be fabricated from low-cost silicon powder. However, because nitridation of silicon is an exothermal reaction, difficulty has been encountered in fabricating thick sintered bodies that exceed 20 mm. In this work, low-cost, thick silicon nitride was fabricated by reaction bonding and post-sintering, and its characteristics and problems were investigated. The obtained silicon nitride showed strength of approximately 500 MPa and fracture toughness of 4.2 MPa m1/2. In fabricating a thick body, powder preparation seems to be an important factor in attaining stable mechanical properties.
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© 2007 The Ceramic Society of Japan
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