Journal of the Ceramic Association, Japan
Online ISSN : 1884-2127
Print ISSN : 0009-0255
ISSN-L : 0009-0255
Silicon Nitride Solid Solution in the Ternary System, Si3N4-AlN-SiO2
Nobuo KAMIYAYoichi OYAMAOsami KAMIGAITO
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1975 Volume 83 Issue 963 Pages 553-557

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Abstract

On the basis of the solid solution in the system, Si3N4-AlN-Al2O3, the presence of silicon nitride solid solution in the system, Si3N4-AlN-SiO2, is expected from the consideration of their composition. The range of the solid solution expected on this basis covers the compo sitional triangle made by connecting the three points, A (57mol% AIN-43mol% SiO2), B (67mol% AIN-33mol% SiO2), and C (100mol% Si3N4). An experimental study of the solid solution proved the expectation valid. In addition to this, the actual range of the solid solution was found to be wider than the triangle mentioned above. This excess range agrees rather well with the expected range on the basis of the vacancy concentration, with the exception of the range near Si2ON2.
The points, A and B, lie on the binary system, AlN-SiO2. The triangle, ABC, is intercepted by the line connecting the two points, AlN and Si2ON2. In other words, the two binary systems, AlN-SiO2 and AlN-Si2ON2, contain the solid solution which is distinguished from the end members in the cystral structure. Thus the presence of two new compounds to represent the solid solution, SiAl2N2O2 and Si2AlN3O is exected for the systems, AlN-SiO2 and AlN-Si2ON2, respectively.
Experimental examinations by X-ray diffraction method, however, failed to confirm the presence of the compounds, may be due to the order-disorder transformation in the compounds, as in some of spinel structure.
The presence of silicon nitride solid solution in the system, Si3N4-AlN-SiO2, shows that the addition of AlN to silicon nitride would be effective to eliminate the glassy phase which is considered to reduce the high temperature strength.

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