2000 Volume 108 Issue 1254 Pages 132-137
The feasibility of microwave sintering of multilayer ceramics containing capacitor was examined. Simultaneous sintering of ceramic substrates, metallic electrodes and a dielectric layer was performed at low temperature and short soaking time by microwave. Higher dielectric constant and smaller deformation were observed in the dielectric layer and substrates, respectively, as compared with the conventional process. Moreover, a dielectric constant more than 6000 was obtained by using electrodes with Cs additive. It was confirmed that diffusion of glass elements into the dielectric layer and Ag diffusion into the substrates were repressed by the Cs additive in electrodes and microwave sintering.
