Abstract
The study of lead-free low-melting sealing glass with properties such as low glass transition temperature (Tg), low softening temperature (Ts), good wettability on the substrate, is in process. One of the low-sintering lead-free glass compositions, the bismuth glass system is considered to be an alternative to lead oxide glass. Research on the development of lead-free low-melting sealing glass in ZnO–P2O5–Bi2O3 (ZPB) system was prepared and the effects of substitution of Bi2O3 for ZnO on the structural, thermal, and wetting properties of a sealing glass were studied. The changes in Tg, Ts and coefficient of thermal expansion (CTE) may reflect decreasing connectivity of the glass structure, due to the increasing Bi–O bonds. This structure changes have an effect on wettability on the substrate. The addition of higher amounts of Bi2O3 improved the wettability of the glass on the substrate. The ZPB glass, possessing properties of low Tg and good wettability, is suitable for low-to-mid temperature sealing applications.