Directly patternable benzocyclobutene and methacrylate silsesquioxanes for microelectronics packaging

Abstract

Progress on two design approaches to patternable, low k dielectrics is described. These formulations are both print in negative tone and are based on polyhedral silsesquioxanes bearing benzocyclobutene moieties. The patternability was demonstrated and both materials have dielectric constants between 2.00–2.22 at optical frequencies. Coefficients of thermal expansion in the plane were found to be 6.0–13 ppm/K, and the materials have reduced moduli between 4–4.6 GPa.