Wettability of Si3N4 by Ni-Base and Cu-Base Filler Metals

Hideki TAKASE; Masaaki NAKA; Julius. C. SCHUSTER

doi:10.14852/jcersjsuppl.112.0.S407.0

Journal of the Ceramic Society of Japan, Supplement 112-1, PacRim5 Special Issue

Session ID : 5

DOI https://doi.org/10.14852/jcersjsuppl.112.0.S407.0

Conference information

Host: The Ceramic Society of Japan

Co-host: Iketani Science and Technology Foundation, International Ceramic Federation, Commemorative Organization for the Japan World Exposition '70, The American Ceramic Society, The Australasian Ceramic Society, The Chinese Ceramic Society, The Korean Ceramic Society, Joint Research Consortium of Synergy Ceramics/Fine Ceramics Research Association, Nanotechnology Researchers Network Center of Japan, The Special Coordination Funds for Promoting Science and Technology, Japan National Tourist Organization, Aichi Prefectural Government, CASIO SCIENCE PROMOTION FOUNDATION, DAIKO FOUNDATION, Nagoya Convention and Visitors Bureau, The Asahi Glass Foundation, The Kao Foundation For Arts And Sciences, The Murata Science Foundation, The Ogasawara Foundation for the Promotion of Science & Engineering, ASAHI GLASS CO., LTD. Research Center, CENTRAL GLASS CO., LTD., ELECTRIC GLASS INDUSTRY ASSOCIATION OF JAPAN (EGAJ), Hattori Company, Ltd., Hitachi Research Laboratory, Hitachi, Ltd., HOYA CORPORATION, INAX Corporation, ITOCHU CERATECH CORP., Japan Cement Association, KYOCERA Corporation, KYUSHU REFRACTORIES CO., LTD., MINO CERAMIC CO., LTD., Murata Manufacturing Co., Ltd., NGK INSULATORS LTD., NGK SPARK PLUG CO., LTD., NICHIAS Corporation, NIKKO COMPANY, Nippon Electric Glass Co., Ltd., Nippon Sheet Glass Co., Ltd., NORITAKE CO., LIMITED, Tokuyama Corporation, TOTO LTD.

Papers

Wettability of Si₃N₄ by Ni-Base and Cu-Base Filler Metals

Hideki TAKASE, Masaaki NAKA, Julius. C. SCHUSTER

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Keywords: Wettability, Contact Angle, Copper, Nickel, Silicon, Titanium

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

The wettablities of Ni-20Si-xTi (x=0∼15) and Cu-5Si-xTi (x=0∼15) alloys against Si₃N₄ were investigatged by measuring contact angles in vacuum using a sessile drop method. The addition of 5 at% Ti or more to Ni-20Si alloys effectively lowers the contact angle against Si₃N₄. The Ni-20Si alloy containing 10 at% Ti shows the lowest contact angle (30 degrees at 1523 K after 3.9 ks) and the best wettability against Si₃N₄. The addition of Ti to Cu-5Si alloys effectively decreases the contact angle. Cu-5Si alloys containing 5 at% Ti or more show low wetting angles at 1473 K. The active metal Ti improves the wettability of Si₃N₄ by these alloys, because it moves to the metal-ceramic interface.

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