Diffusion Bonding of Superconducting Nb-59.8 at % Ti Plates

Abstract

The applicability of diffusion bonding to superconducting joints is examined using a joint between two Nb-Ti plates. The joint made at 900°C yields critical current density nearly equal to that of base metal by post-bond treatment, i.e., cold-rolling plus aging process. The reduction in critical temperature of as-bonded joint was within 1K at all the bonding temperatures (600-900°C). The ultimate tensile strength of the joint made at 900°C reached that of base metal, but the breaking strain was reduced.
The diffusion bonding is likely to be applied to joining superconducting Nb-Ti plates with an appropriate post-bond process.