Abstract
Thermosonic flip-chip bonding is a low cost assembly method and has high productivity. In this bonding, the bump formed on a device chip is directly bonded to a substrate electrode in a short time. This paper describes the effect of bump condition on bondablity of flip-chip bonding. Experiments were carried out using a chip with aluminum electrodes and a gold-plated ceramic substrate. Two kinds of bumps that differ in strength and deformation were compared in flip-chip bondability. As a result, the highly deformed bump with high strength made bond strength between the bump and substrate electrode stronger. Additionally, bump deformation after flip-chip bonding and bond strength between the bump and chip electrode did not depend on the bump condition.
