Development of Partial Copper Plating Method Using Solid Electrolyte Deposition

Abstract

A partial plating method using solid electrolyte deposition (SED) was developed for the partial plating of copper. An electrochemical cell was fabricated by 3D printer. Firstly, the solid electrolyte membrane is set on the cathode metal plate. The anode metal bar is then vertically contacted to the solid electrolyte membrane. Finally, the electrodeposition can be performed by applying the constant current or voltage. In the present study, the copper plate and the copper bar were used as the cathode and the anode for the copper electrodeposition, respectively. The effect of adhesion of the solid electrolyte membrane to the cathode copper plate on the electrodeposition was investigated by controlling the pressure on the anode copper bar. The suitable conditions for the copper electrodeposition using developed method were discussed.