Journal of Japan Institute of Copper
Online ISSN : 2435-872X
Print ISSN : 1347-7234
Joining, Melting, Casting
Measurement and Validation of Heat Transfer Coefficient between Molten Oxygen Free Copper and Mold
Toshio SakamotoAkira MatsushitaYuichi MotoyamaHitoshi TokunagaToshimitsu Okane
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2020 Volume 59 Issue 1 Pages 360-364

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Abstract

In the continuous casting process of copper and copper alloys, the heat extraction in the mold accounts for a large proportion of the heat extraction of the entire ingot. In order to perform appropriate heat extraction and obtain a stable quality ingot, it is important to understand the heat transfer coefficient between the ingot and the mold and to maintain the heat transfer rate appropriately. However, in the past report examples, as the heat transfer coefficient between the ingot and the mold, the average value of the entire mold or the value between the solid phase and mold are considered but few examples focus on the heat transfer coefficient between liquid phase and the mold. Also, in the field of mold casting, there are few examples in which the liquid–phase heat transfer coefficient is measured clearly distinguished from the solid–state heat transfer coefficient. In this report, the heat transfer coefficient between the liquid phase and the mold was clearly separated from the heat transfer coefficient of the solid phase, and the actual measurement was performed. As a result, it was found that the value was several times to an order of magnitude larger than the value conventionally reported in copper continuous casting. Using the obtained thermal conductivity values, a thermal fluid simulation of copper continuous casting was performed. As a result, there was no significant difference in the mold temperature or the final solidification depth of the ingot as compared with the case where the conventional values ​​were used. But there was a clear difference in the solidification start position.

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© 2020 Japan Institute of Copper
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