2021 Volume 60 Issue 1 Pages 108-112
The effects of composition and microstructure on temperature dependence of electrical resistivity in Cu–Xmol%Mn–Ymol%Ni alloys (X=12.0〜12.9, Y=1.6〜3.8) were studied. It was found that the amount of Mn added follows Linde’s rule, while the amount of Ni added does not in the resistivity of these alloys. In these alloys, the resistivity increased from 0 to about 50°C and decreased from about 50 to 150°C monotonically. The higher the temperature at which the resistivity reached its maximum was, the smaller the resistivity change from 0 to 150°C became. Moreover, it was found that the resistivity change increases with the addition of Mn, while it decreases with the addition of Ni. In terms of the microstructure, the fine recrystallized grain and the strain by cold working made the resistivity change larger. In Cu–12.5Mn–2.6Ni, it was clear that it is effective to reduce the amount of Mn, increase the amount of Ni, and make the recrystallized grain coarser, in order to reduce the temperature change of the resistivity from 0°C to 150°C.
