Journal of Japan Institute of Copper
Online ISSN : 2435-872X
Print ISSN : 1347-7234
Plating
Influence of Cu–Sn Intermetallic Compound Surface Form on Contact Resistance Behavior of Fretting Corrosion of Tin Plating
Yutaro UedaMasahiro TsuruHiroshi Sakamoto
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2021 Volume 60 Issue 1 Pages 227-230

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Abstract

Influence of Cu–Sn intermetallic compound surface form on a fretting corrosion phenomenon of reflowed tin plating was investigated. This paper reports and discusses experimentally observed results on contact resistance behavior and wear behavior during fretting corrosion testing using samples with different surface roughness. Cu–Sn intermetallic compound plating was prepared to eliminate the influence of the dispersed state of tin and Cu–Sn, intermetallic compound. The main results are summarized as follows. (a) The results of the fretting corrosion test showed the peak value of contact resistance decreased with the rough–surface samples. (b) The rough–surface samples had both convex and concave areas. It is thought that the convex areas promote the discharge of tin abrasion powder to the outside of the contact area or to concave areas.

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© 2021 Japan Institute of Copper
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