Analysis of Deformation Microstructure and Mechanical Strength using Simulation Model during Deformation Process in Precipitate Hardening Copper Alloys

Abstract

Recently, in response to downsize of electronics connector and increase of the mount density in high performance of electronic device, the compatibility of the strength, the workability, and high conductivity are needed in copper alloys, by controlling in the combined process of cold working and aging treatment. In the precipitate hardening alloy, microstructure and mechanical property change in cold working process becomes very complex, because the interaction between dislocations and precipitates affects to the matrix microstructure. In this analysis, the calculation model of microstructure changes during deformation processing in precipitate hardening alloy was proposed to evaluate microstructure and mechanical property changes which are resulted from the interaction of precipitates and dislocations, the formation and the dynamic recovery of dislocation cell/substructure and deformation twin. And the microstructure changes by cold working processing were analyzed about a relationship between a processing condition, the microstructure, and the flow stress with this model. By applying this evaluation method to the cold rolling process of Cu–Fe alloy, Cu–Cr alloy and Cu–Ni–Si alloy which were solution treated and aging treated, the validity of calculation model was confirmed with comparing experimental and calculated results.