Investigation of Pulse Heat Assisted Cu/Cu Bonding Using Metal Salt Generation Bonding Technique

Abstract

In recent years, in order to reduce the use of fossil fuels, the electrification of automobiles and other vehicles using renewable energy sources has been promoted. For example, in the electronics industry, high–density, high–integration packaging technology is required, and power semiconductors are the mainstream, especially in inverters and converters used in hybrid and electric vehicles. A connection method that can withstand the operating temperature of power semiconductors is necessary, but no established connection method has yet been found. Therefore, direct solid phase bonding is a promising bonding method, and various bonding methods have been investigated, such as the metal salt generation bonding technique. The metal salt generation bonding method has been investigated for solid phase bonding of Cu, but it is not suitable for electronic packaging because the bonding time is long and the bonding is done in a vacuum. In this study, we investigated short–time bonding in air using the pulse heat bonding method, which utilizes the formation and decomposition reaction of metallic salts.