Abstract
Effects of diluted phosphoric acid etching on the adhesion of 4-META/MMA-TBB resin to enamel were investigated.The thermal cycling test was used for the evaluation of adhesive stability.After 30 sec etching with 3wt% phosphoric acid and 5wt% phosphoric acid, the adhesion of the resin to enamel was tested by application of 200 thermal cycles.The tensile bond strength in each diluted phosphoric acid solution was 8.1MPa and 9.3MPa, respectively.These tensile bond strength values were found to be the same as that of 65wt% phosphoric acid etching.Moreover, resin tags were found and no crack in the interface area by SEM, in the case of use of more than 1wt% phosphoric acid.Etching with diluted phosphoric acid was effective in adhesion of 4-META/MMA-TBB resin to enamel.
