Abstract
An adhesive monomer (β-methacryloyloxyethyl hydrogen succinate) was electrodeposited on a dental alloy surface to investigate improvement of the adhesion to dental methacrylate resin. In this experiment, bond strength was examined in relation to the treatment condition (solution concentration and current) for electrodeposition on 18-carat gold alloy. In addition, findings were compared with the previous results for 12% Au-Ag-Pd alloy, Co-Cr alloy and pure titanium. Results:A functional monomer was electrodeposited on the alloy surface and its carboxylate ion formed an ionic bond, but its methacryloyl group did not react. Effective electrodeposition conditions for improving the bond strength between 18-carat gold alloy and methacrylate resin were a concentration of 20-30% and treatment current of 0.5-1 mA. Bond strength under these conditions was 11.5-13.3 MPa. This value represented the highest bond strength among 4 kinds of dental alloys.
