Studies on Soldering Alloys for Titanium Using Infrared Radiation Soldering

Abstract

Solder comprising of titanium, nickel, and indium were experimentally produced to apply to the infrared radiation soldering of titanium. Eutectic structures consisting of nickel and a metallic compound, Ni₃In, were formed in the Ni-In binary alloys containing 10〜30wt% of indium, and only Ni₃In was formed in Ni62In38. The Ti-Ni-In ternary alloys consisted of α-Ti and a metallic compound Ti₂Ni. Solidus and liquidus points of Ni-In alloys decreased with increasing amounts of indium, whereas there were no significant differences in solidus and liquidus points of the Ti-Ni-In ternary alloys. The soldering strength of the titanium bar soldered with Ni-In binary alloys decreased with increasing amounts of indium in the solder. The soldering strengths of Ti60Ni30In10, Ti60Ni25In15, and Ti60Ni20In20 showed excellent soldering strengths (250〜290MPa) and were similar to those of a commercial TiCuNi solder. The specimens having a continuous boundary layer with a high content of indium showed excellent soldering strengths.