Abstract
This study examined the effect of the polymer/Sn composite plating on adhesive strength of Panavia EX and Super Bond C & B to type IV gold alloy. A cationic surfactant was found to be necessary for providing a sufficient amount of polymer particles in the Sn plating bath. The adequate particle size range was 0.5〜1.0 μm. The adhesive strength using polymer/Sn composite plating was increased by 70〜80%. The maximum adhesive strength was obtained when the polymer concentration in the plating bath was in the range of 5〜10%, but the adhesive strength was little influenced by the different polymers.