Abstract
Recent status of advanced science, technology and engineering on PACS is reviewed. Due to the motion for computer " downsizing", many PACS related key components have been enormously advanced. Giga level components, such as giga bit IC memory, giga instruction per second (GIPS) MPU chip, giga bit per sec. (Gbps) transmission etc. have been/will be available. The second generation PACS will be constructed soon on the base of these advanced techonologies.
