Material Design and Optimization System by Weak Conditioned Combinatorial Linear Programming

Abstract

Die-bonding films (reaction-induced polymer alloy films) are useful to the 3D Package, which are suitable for compact electronic products with high calculating speed like smart phones. Properties of the films are widely changed by the ratio of epoxy resin, acrylic polymer and inorganic filler contents. To optimize the properties of the die-bonding films, the relationship between the materials formulation and properties of film was examined, and calculated optimum formulation by using the weak conditioned combinatorial linear programming and user-friendly software. We also proposed material design system in which experimental results ware stocked two databases and reused. The software is applicable not only to semiconductor related materials but also to any formulation such as paint, medicine, food.