2018 Volume 18 Issue 3 Pages 176-183
When an electrodeposited copper or nickel foil is subjected to a repeated load, grain growth occurs in the foil. Since the thermal recrystallization occurs when the ambient temperature rises, the upper limit of the ambient temperature is limited to 80 ℃ and 250 ℃ for the copper foil and the nickel foil, respectively. In this paper, the cyclic stress measurement utilizing grain growth of a nickel alloy foil under high ambient temperature was investigated. First, the nickel alloy foil was heat treated under various conditions. Then the grain size was analyzed using EBSD and XRD in order to check whether grain growth occurred. Moreover, the pulsating tension tests were carried out under 350 to 400 ℃, and the grain size was also analyzed. It was revealed that the nickel alloy foil was recrystallized at a temperature of 350 to 450 ℃. Moreover, the grain growth due to cyclic loading could also be confirmed under 350 to 400 ℃. Therefore, the possibility of stress measurement by nickel alloy foil under high temperature environment was suggested.
