Recent Stress and Strain Evaluation for Semiconductor Packaging

Journal of the Japanese Society for Experimental Mechanics

Print ISSN : 1346-4930
ISSN-L : 1346-4930

Recent Stress and Strain Evaluation for Semiconductor Packaging

Tetsuo KUMAZAWA

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JOURNAL FREE ACCESS

2001 Volume 1 Issue 4 Pages 186-190

DOI https://doi.org/10.11395/jjsem2001.1.186

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© The Japanese Society for Experimental Mechanics

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