Abstract
Diamond materials are expected to be used as future substrates for power devices because they have excellent material properties, such as remaining stable at high temperatures and high resistance to chemical environments. On the other hand, etching and mechanical processing are very difficult because of the chemical and physical properties of diamond. As device materials must be polished without crystallographic distortion beneath a polished substrate, simplified planarization techniques accompanied with high surface quality are especially required. Ultraviolet rays excited polishing of single crystal diamond substrates has been studied in our laboratory, and the UV-assisted polishing characteristics, such as a higher polishing rate and superior final surface roughness, have been revealed. By using these polishing techniques, we can use diamond as a substrate material for future power devices because we are able to polish a mosaic wafer containing joined samples of two or more substrates, and minimize the occurrence of dislocation on the polished substrate. This paper reports the effective in diamond substrate for power device.
