Abstract
The properties of the polished surfaces of semiconductor crystals by optical and metallographic operations have been investigated by means of micro-etching, phase contrast microscope and electron microscopy. It is concluded that micro-cutting introduces the aggregations of fine scratches on the metallographically polished surfaces, and thermal flow plays an important part in the origination of the optically polished surfaces. Moreover, the depth of worked layers on polished surfaces including the additional influence isestimated to be a value of 1-3μ.
