Journal of the Japan Society of Precision Engineering
Print ISSN : 0374-3543
Work-hardening Process of Scratch-deformed Surface Layer of Cu Single Crystals
Crystallographic Study of Scratching (3rd report)
Hideaki KAWABEMuneharu TAKEUCHINobuyuki SHINOHARANozomu OKA
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1979 Volume 45 Issue 532 Pages 455-460

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Abstract
To clarify the formation mechanism of work-hardened surface layer introduced at the time of abrasive working, (001) single crystal surfaces of Cu were scratched with diamond cone styluses, and the examinations were made around the end of scratch-grooves and also around the cross and vertical-sections of grooves by means of X-ray microbeam technique, TEM, etching and micro-hardness measurements. It was found that the three dimensional extent of deformed region around the groove varies with the scratch direction. And from the analysis of Laue asterisms on X-ray diffraction patterns, the distribution of the activated slip systems contributing to the scratch deformation was estimated. The explanation was made about the work-hardening process around the groove considering the interactions of each slip deformation processes. The dislocation structure near the surface of groove end shows the corresponding variation to the deformation processes, and besides, the anisotropy of hardness distribution beneath the groove can be explained from the difference of the deformation processes.
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