Abstract
In this paper, tool life in wafer rotation grinding is compared with that in creep feed grinding. Then the trial to improve the tool life is done by means of doing dressing and grinding simultaneously. The main results obtained are as follows: (1) Tool life in creep feed grinding depends on increasing of surface roughness and normal grinding force and changing of outlook of ground surface. And, in this case, it is about 100 wafers of 4 inch size. (2) Tool life in wafer rotation grinding depends on increasing of normal grinding force, and, in this case, it is 10-15 wafers of 5 inch size when dressed by PVAR 600, 60-70 wafers of 5 inch size when dressed by GC 1000 H. (3) Surface roughness and normal grinding force are maintained nearly constant by means of each time dressing and intermittent dressing. And these dressings are done during grinding, so there is no loss time for dressing. Therefore the problem of tool life can be resolved. (4) Wear of grinding wheel by dressing in wafer rotation grinding is nearly equal to that in creep feed grinding.
