Abstract
In this paper, relationship between the residual stress in the ground surface of silicon nitrides, with various grinding conditions and the grinding factor was investigated, in order to make clear the foundamental grinding factors which affect the residual stress. Moreover the force acting on a grain cutting edge which was dynamic force in grinding was calculated, and relationship between the force acting on a grain cutting edge and the residual stress was investigated. The results are summarized as follows : (1) The compressive residual stress in the ground surface becomes large with the increase of the grain size and the hardness of bonding material of grinding wheel. (2) The compressive residual stress tends to increase with the increase of the surface roughness. (3) Considering only mechanical stress, the compressive residual stress is increased with the increase of the obtained force acting on a grain cutting edge, and the stress is saturated at a certain value.
