Ductile-Mode Mirror Cutting of Single-Crystal Silicon (1st Report)

Effects of Cutting Speed on the Brittle/Ductile Mode Transition Behavior in Cutting Processs

Abstract

The purpose of this study is to make clear the influence of cutting speed on the transition behavior from brittleto ductile mode in the cutting process of single-crystal silicon using a single point diamond tool. The main resultsobtained in this study are summarized as follows : (1) When the feed rate falls below a critical value fc at a constant cutting speed and a constant tool depth of cut, the brittle/ductile mode transition phenomenon takes place. The critical feed rate fc increases with an increase of the cutting speed. (2) The critical depth of cut dc at which the brittle/ductile mode transition phenomenon occurs increases with an increase of the cutting speed and it is hardly affected by the feed rate. (3) Mirror surfaces with roughness of 15-30 nm Ry can be generated by optimizing the feed rate and the cutting speed.