Abstract
ID-Blade sawing is widely used as the slicing method for the semiconductor materials represented the silicon ingot. At present, the size (diameter) of silicon ingot tends to increase, and for example, it changes the slicing method to the multi wire sawing used loose abrasive grains. However, it can be throught that the demand for the ID-Blade sawing is still continuing because of the high precision slicing in this method. This study aims to establish the vibration ID-Blade slicing technique utilizing the elliptical vibration in X-Y plane to improve the slicing efficiency and accuracy furthermore. In this paper, the slicing mechanism of elliptical vibration ID-Blade sawing for the dynamical consideration and the effect of the elliptical vibration on the slicing force are described. As the results, the elliptical vibration slicing can be brought out the decreasing of the slicing force from both theoretical and experimental considerations.
