Abstract
High definition and low cost are needed to further widen the use of liquid crystal displays. High-definition liquid crystal can be achieved by improving the mounting accuracy of tape carrier packages (TCPs), which are ICs that drive liquid crystal. Low-cost liquid crystal can be achieved by mounting the multiple TCPs at a time to enhance productivity. Important development challenges in accomplishing these two tasks are high precision and soaking of the bonding head in the TCPs system. An optimum bonding head shape has been obtained by thermal analysis using the finite element method (FEM).