Abstract
The electrodeposition of Cu-graphite composite film from copper sulfate bath containing graphite particle has been studied. The graphite particles were oxidized with nitric acid in order to introduce surface oxides. The role of the functional groups on the graphite edge during Cu-graphite composite plating was evaluated by the potentiometric titration method. The titration curve obtained in the presence of graphite particles and that without graphite particles crossed over each other at the pH 2.45 which is probably pKa of the compound in the presence of Cu2+ in the bath. However, this value is found to be lower than the pH 3 in the same solution without Cu2+ ion. This phenomena might be recognized by the adsorption of Cu2+ ion on the functional group of the graphite at the pH higher than the pKa value. Upon analyzing the surface morphology of the Cu-graphite composite coating, it is found that the specific ordered structure of the coating can be fabricated by controlling the pH of the bath.
