Development of a New Multi Layer Substrate (PALAP) Using Ag-Sn Liquid Phase Sintering Process

Abstract

In order to construct the multi layers IVH (Interstitial Via Hole) structure with only one time hot pressing; we have developed the new diffusion bonding technology. The liquid phase sintering of Ag-Sn mixed powders (Ag/Sn:65/35 mass%) is utilized for bonding between Copper layers.
In this paper, the pore formation at Ag and Ag-Sn sintering process was investigated, and the effect of Sn liquid phase on pore formation was discussed. However Ag formed Ag₃Sn with the solid diffusion reaction up to 453 K, excess Sn particles exist surrounded with Ag₃Sn. While Sn particles are fusible above 494 K, the shell of Ag₃Sn is infusible. Pore forms with Sn particles effusion