Development of a New Type Saw Wire Fixed Diamond Abrasive Grains with Solder and Ni Electroplating and Its Application to Slicing of Silicon and Sapphire Ingots

Abstract

We have carried out research and development of high-performance diamond abrasive grains fixed saw wire for electronic equipment material for wafer fabrication, such as solar cells for silicon and sapphire for the LED package substrate. It advances the prototype of the saw wire, to produce a product in a way that makes a commercial basis. Through these research and development activities, we report on the process that led to the production of silicon wafers for solar cells and sapphire wafers for LED package substrate using novel saw wires fixed diamond abrasive rains with solder and Ni electroplating process.