Molecular Bonding Technology - an Innovative Manufacture Technology in the 21st Century

Abstract

We have developed a molecular bonding technology that forms a layer of molecules on the surface of the adherends and provides a smooth surface with strong joining force for the manufacturing of structures composed of different materials. We have applied this technology to the process of direct copper plating on a polyimide film with a smooth surface in order to manufacture flexible printed circuits (FPCs) with high performance.