Journal of the Japan Society of Powder and Powder Metallurgy
Online ISSN : 1880-9014
Print ISSN : 0532-8799
ISSN-L : 0532-8799
Paper
Production of Copper Nanoparticles Dispersion Liquid Using New Copper Complex Solution
Keita KAMIBAYASHINobuyuki SUGIMOTOMasashi WADAMitsuo KAWASAKITatsuhisa KATO
Author information
JOURNAL OPEN ACCESS

2017 Volume 64 Issue 12 Pages 667-672

Details
Abstract

Conductive inks that are composed mainly of metal nanoparticles are used as core materials for printed electronics. We developed a production method of new copper complex solutions, which by reductive heating yielded copper nanoparticles dispersion liquids of less than 100 nm in particle diameter. The copper complex solutions are grouped into three classes according to the ratio of two absorbance maxima in their extinction spectra, which determines the average particle diameter of the product copper nanoparticles. We found that Class II copper complex solution contains ultrafine copper nanoparticles of only ~1 nm in diameter as secondary species. They serve as effective nuclei allowing a size-controlled copper nanoparticle growth from the copper complex solution, thereby limiting the average size of the product copper nanoparticles to ~20 nm.

Content from these authors
© 2017 by Japan Society of Powder and Powder Metallurgy

本論文はCC BY-NC-NDライセンスによって許諾されています.ライセンスの内容を知りたい方は,https://creativecommons.org/licenses/by-nc-nd/4.0/deed.jaでご確認ください.
https://creativecommons.org/licenses/by-nc-nd/4.0/deed.ja
Previous article Next article
feedback
Top