Abstract
Size change and creep deformation of sintered alumina in the bonding process have been investigated. The ratio of size change to total length of the specimen increases exponentially with the bonding temperature and is proportional to increase in the bonding pressure and the holding time. From the result of a hardness test on the bonding layer, it is suggested that the bonding process may be finished at 1400°C. Also, creep deformation of the specimen occurs during the bonding process. Creep behavior of specimen in the bonding process corresponds to that in compression creep tests for sintered alumina from the view point of the activation energy for creep deformation, although the bonding process in the bonding layer is similar to the desification process of bonding powder by sintering.
