Abstract
Studies on the wettability and the bonding of Cu-Sn-Ti system (pure metals except for Ti, binary alloys and a ternary alloy) against sintered Al2O3 compacts were carried out. Results obtained were as follows:
(1) Wettability of Cu, Sn pure metals, Cu-10%Sn and Cu-5%Ti binary alloys in vacuum (1.3×10-2-4.0×10-3 Pa) were unsatisfactory. On the other hand, Cu-10%Sn-5%Ti ternary alloy was comparatively wettable, where reaction layer corresponding to Ti3Al containing slight Cu and Sn was formed in the interface between brazing alloy and sintered Al2O3 compact. Sn-5%Ti binary alloy against sintered Al2O3 showed fairly excellent wettability, but did not form any reaction layer between them.
(2) Bonding strength of sintered Al2O3 compacts brazed with Cu, Sn pure metals and Cu-10%Sn or Cu-5%Ti binary alloys had a tendency to decrease with increasing the degree of vacuum (or with decreasing oxygen partial pressure) of bonding atmosphere. Bonding strength of sintered Al2O3 compacts brazed with Sn-5%Ti and Cu-l0%Sn-5%Ti alloys which were good wettable to sintered Al2O3 were comparatively high, and those had a tendency to increase with raising bonding temperature.
